Digital Concrete: Opportunities and Challenges

Authors

  • Timothy Wangler Institute for Building Materials (IfB), ETH Zurich
  • Ena Lloret Institute for Technology in Architecture, ETH Zurich
  • Lex Reiter Institute for Building Materials (IfB), ETH Zurich
  • Norman Hack Institute for Technology in Architecture, ETH Zurich
  • Fabio Gramazio Institute for Technology in Architecture, ETH Zurich
  • Matthias Kohler Institute for Technology in Architecture, ETH Zurich
  • Mathias Bernhard Institute for Technology in Architecture, ETH Zurich
  • Benjamin Dillenburger Institute for Technology in Architecture, ETH Zurich
  • Jonas Buchli Institute of Robotics and Intelligent Systems, ETH Zurich
  • Nicolas Roussel IFSTTAR, Laboratoire Naviere, Université Paris Est
  • Robert Flatt Institute for Building Materials (IfB), ETH Zurich

DOI:

https://doi.org/10.21809/rilemtechlett.2016.16

Keywords:

Concrete, Digital Fabrication, Rheology, Set on Demand, Thixotropy

Abstract

Digital fabrication has been termed the “third industrial revolution” in recent years, and promises to revolutionize the construction industry with the potential of freeform architecture, less material waste, reduced construction costs, and increased worker safety. Digital fabrication techniques and cementitious materials have only intersected in a significant way within recent years. In this letter, we review the methods of digital fabrication with concrete, including 3D printing, under the encompassing term “digital concrete”, identifying major challenges for concrete technology within this field. We additionally provide an analysis of layered extrusion, the most popular digital fabrication technique in concrete technology, identifying the importance of hydration control in its implementation.

Digital Concrete: Opportunities and Challenges

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Published

31.10.2016

How to Cite

(1)
Wangler, T.; Lloret, E.; Reiter, L.; Hack, N.; Gramazio, F.; Kohler, M.; Bernhard, M.; Dillenburger, B.; Buchli, J.; Roussel, N.; Flatt, R. Digital Concrete: Opportunities and Challenges. RILEM Tech Lett 2016, 1, 67-75.

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